eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils
4 in 1 design bga reballing kit, capable apply to eMMC153/eMMC169, eMCP162 /eMMP186 nand flash IC reballing at the same time
Moldcore designs with dismountable, easy to change through two screws, change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing
Moldcore uses high accuracy IC Grinding Machine, accurate IC location
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