"
Item" "
Producing Capability"
Layer 1-20 lays(including rigid and flexible circuit)
Panel size max:250*550(mm)
Drilling diameter "Max. Diameter: 6.5mm (256mil)
Min. Diameter: 0.20mm (8mil)"
Base Material Copper Thickness "Max.: 0.105mm(4mil)
Min.:0.012mm(0.5mil)"
Insulating Layer Thickness "Max.: 0.05mm(PI) (2mil)
Min: 0.0125mm(PI) (0.5mil)"
Electroplating Sn/Pb Thickness 3 um --- 20 um
Electroplating Au/Ni Thickness "Au:0.05um
Ni:1um--5um"
Chemical Immersion Ni/Au Thickness 0.05 um --- 0.1 um
Electroplating Sn Thickness 3 um --- 20 um
Etching Line Width & Space: "S/S: 2.5mil (0.06mm)
D/S: 2.5mil (0.06mm)"
Etching Tolerance Width:±20%; Special Width: ±10%
Outline Tolerance(from side to side) ±0.05mm(±2mil)
Parts Fixed Position Tolerance ±0.2mm (8mil)
Finishing Treatment "Immersion Gold, Immersion Tin
Plating Gold, Plating Tin
OSP, etc."
Soldermask Green,White,Black
E-Testing 100% E-Testing (High Voltage Testing);Flying Probe Testing
Other test ImpedanceTesting,Resistance Testing, Microsection etc.,
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