1, double layer glass epoxy copper clad laminate integrated pcb 2, ShengYi FR4 material
3, immersion gold 4, green solder mask
5, white silk 6, Board thinkness 1.6mm Quotation time: 1. For PCB & FPC: quotation within 1 hours if all information are clear 2. For PCBA: quotation within 2 days if all information are clear One-stop Service: 1. PCB Copy 2. PCB drawing / design according to your schematic diagram 3. PCB manufacturing 4. Component sourcing 5. PCB Assembly 6. PCBA test Delivery Time:
Layers | Sample | First Order | Repeat Order |
Single side | 3 days | 7 days | 6 days |
Double side | 4 days | 8 days | 7 days |
4 Layer | 7 days | 9 days | 8 days |
6 Layer | 8 days | 10 days | 9 days |
8 Layer | 10 days | 12 days | 10 days |
10 Layer | 12 days | 14 days | 12 days |
Alu-base | 3 days | 8 days | 7 days |
FPC 1 layer | 5 days | 8 days | 8 days |
Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
Layer No. | 1 - 12 Layers |
Board thickness | 0.0075" (0.2mm)-0.125" (3.2mm) |
Board Thickness Tolerance | ± 10% |
Copper thickness | 0.5OZ - 4OZ |
Impedance Control | ± 10% |
Warpage | 0.075%-1.5% |
Peelable | 0.012" (0.3mm)-0.02 (0.5mm) |
Min Trace Width (a) | 0.004" (0.1mm) |
Min Space Width (b) | 0.004" (0.1mm) |
Min Annular Ring | 0.004" (0.1mm) |
SMD Pitch (a) | 0.012" (0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027" (0.675mm) |
Regesiter torlerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005" (0.125mm) |
Soldermask Clearance (b) | 0.005" (0.125mm) |
Min SMT Pad spacing (c) | 0.004" (0.1mm) |
Solder Mask Thickness | 0.0007" (0.018mm) |
Hole size | 0.008" (0.20mm)-- 0.257" (6.5mm) |
Hole Size Tol (+/-) | ± 0.003" (± 0.0762mm) |
Aspect Ratio | 10:01 |
Hole Registration | 0.003" (0.075mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au: 1-3u' ' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ± 0.004' ' (± 0.1mm) |
Beveling | 30° 45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
Certificate | ROHS ISO9001 TS16949 SGS UL |
Special requirements | Buried& blind vias, Impedance control, via plug, BGA soldering and gold finger |
Related Product Tags:
automotive pcb , Printed Circuit Board PCB , pcb assembly , pcba pcb fpc , mutlilayer pcb , electric iron pcb , PCB , printed circuit board , printed circuit boards , china pcb manufacturer , multilayer pcb , Multilayer Pcb Printed Circuit Board , Osp Printed Circuit Board , Pcb Printed Circuit Board